ECE Seminar: Engineering Heterogeneous Materials and Devices for 3D-Integrated Energy-Efficient Electronics
Engineering Heterogeneous Materials and Devices for 3D-Integrated Energy-Efficient Electronics
Asir Khan, University of California, Berkeley & Stanford University
Monday, April 7 at 3:00pm
ML107 or Zoom (https://yale.zoom.us/j/95179745869)
Hosted by: Professor Jung Han
Abstract:
With the rise in global data demands, energy efficiency in electronics has become a defining challenge for sustainable progress in AI, healthcare, IoT, and beyond. Today's electronics, constrained by materials and architectures that separate computing and memory, are approaching their energy and latency limits for data-intensive applications. Emerging solutions such as 3D integration of logic and memory devices offer great promise; however, their realization requires innovations in materials, transport physics, device engineering, and semiconductor-compatible fabrication. In this talk, I will discuss how atomic-scale engineering and integration of heterogeneous materials and devices can address these intertwined challenges. I will highlight two key examples from my work: (1) electro-thermal and interface engineering in chalcogenide heterostructures enabling low-power memory on both rigid and flexible platforms, and (2) exceptional surface transport and reduced electrical resistivity in non-crystalline semimetals, introducing new avenues in low-resistance electronics. The relatively low fabrication temperatures of these materials and devices further enhance their potential for 3D integration. I will conclude with my vision for advancing heterogeneous materials and multifunctional nanodevices to drive the future of 3D-integrated, energy-efficient electronics.
Bio:
Asir Khan is a postdoctoral scholar at UC Berkeley working with Prof. Sayeef Salahuddin, and a visiting postdoctoral researcher at Stanford University. Asir received his PhD (2023) and MS in Electrical Engineering from Stanford University, where he worked with Prof. Eric Pop and was awarded the Stanford Graduate Fellowship. Asir’s research focuses on advancing energy-efficient electronics through atomic-scale engineering of heterogeneous materials and nanodevices, addressing their energy limits. His interdisciplinary contributions have been recognized with the 2022 IEEE-EDS PhD Fellowship, Materials Research Society (MRS) Gold Graduate Award, and 2023 AVS Russell & Sigurd Varian Award. He received the Best Technology Paper Award at the 2022 IEEE Symposium on VLSI Technology and Circuits, along with multiple Best Presenter Awards including at the 2022 MRS Fall meeting, 2023 SRC TECHCON and 2023 AVS Symposium. Asir has held research intern positions at TSMC and IBM TJ Watson and currently serves as a Fellow at the Stanford Emerging Technology Review.
