Yale to host international conference on packing problems

02/26/2019
Departments: Mechanical Engineering and Materials Science

Researchers from around the world will gather at Yale this summer for the 4th International Conference on Packing Problems.

With more than 100 researchers expected to attend, the five-day conference will include more than 35 invited presentations and a number of contributed talks. The event will focus on a wide range of topics that involve packing problems including packing and flows in granular media, jamming and glass transitions in metals, colloids, gels, droplets, foams and emulsions, tissue morphogenesis, tissue and tumor mechanics, and protein structure. 

Yale was chosen to host this year's conference because of its leadership in the fields of granular media, soft matter, and biological physics. 

“This conference will enable the formation of new international collaborations across disciplines and will allow us to highlight the vibrant ongoing research in science and engineering at Yale,” said the event’s organizer, Corey O’Hern, professor of mechanical engineering and materials science, physics, and applied physics.

The event, which is held every two to three years, follows three very successful conferences in Dublin, Ireland, Erlangen, Germany, and Shanghai, China in 2012, 2014, and 2016, respectively. It will feature more than 35 leading scientists from the U.S., Europe, India, China, Japan, and Australia. The conference will include morning and afternoon sessions of talks, two poster sessions, a number of contributed talks from junior scientists, and a formal banquet. 

The conference is supported by several Yale units, including the Provost's Office, the School of Engineering & Applied Science, Department of Mechanical Engineering & Materials Science, Department of Physics, the Systems Biology Institute, as well as the National Science Foundation and Army Research Office.

The 4th International Conference on Packing Problems runs from Monday, June 3 to Friday, June 7. For more information, go to the event’s flyer. To register, visit https://cvent.me/XdrE4.